The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein.
Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The entire content of the above identified application is incorporated herein by reference. This application claims the benefit of priority to Taiwan Patent Application No.
The chip scale package structure according to claim 1, wherein a surrounding lateral side of the package body is flush with a surrounding lateral side of the board.ĬROSS-REFERENCE TO RELATED PATENT APPLICATION The chip scale package structure according to claim 1, wherein the package body is gaplessly connected to the entirety of the surrounding lateral surface of the thermally conductive adhesive sheet, and the surrounding lateral surface of the thermally conductive adhesive sheet is in an arced shape that has a center of curvature located in the thermally conductive adhesive sheet.ġ0. The chip scale package structure according to claim 1, wherein the package body is gaplessly connected to the entirety of the surrounding lateral surface of the thermally conductive adhesive sheet, and the package body is not connected to the heat-dissipating surface of the thermally conductive adhesive sheet.ĩ. The chip scale package structure according to claim 1, wherein the thermally conductive adhesive sheet has an adhesive layer that is adhered to the heat-output surface, and wherein an adhesion of the adhesive layer is able to be maintained for at least 8 hours under a temperature of 180° C.Ĩ. The chip scale package structure according to claim 1, wherein an area of the heat-dissipating surface of the thermally conductive adhesive sheet is equal to at least 50% of the area of the heat-output surface connected to the thermally conductive adhesive sheet, and wherein the heat-dissipating surface is configured to be exposed in the air or is configured to be connected to a heat-dissipating component.ħ. The chip scale package structure according to claim 1, wherein the package body is a molding compound having a top side that is arranged away from the board and that is coplanar with the heat-dissipating surface of the thermally conductive adhesive sheet.Ħ. The chip scale package structure according to claim 1, wherein the thermally conductive adhesive sheet is connected to an entirety of the heat-output surface, and the surrounding lateral surface of the thermally conductive adhesive sheet is flush with a surrounding lateral surface of the die.ĥ. The chip scale package structure according to claim 1, wherein the thermal conductivity of the thermally conductive adhesive sheet is larger than a thermal conductivity of the heat-output surface, and the thermal conductivity of the thermally conductive adhesive sheet is larger than 1 W/mK.Ĥ. The chip scale package structure according to claim 1, wherein a thickness of the thermally conductive adhesive sheet is smaller than a thickness of the die, and the thickness of the thermally conductive adhesive sheet is within a range of 0.15 to 0.23 mmģ. A chip scale package structure of a heat-dissipating type, comprising: a board a die fixed on and electrically coupled to the board, wherein the die has a heat-output surface arranged away from the board a thermally conductive adhesive sheet gaplessly adhered to the heat-output surface of the die and connected to at least 50% of an area of the heat-output surface, wherein the thermally conductive adhesive sheet has a heat-dissipating surface arranged away from the die and a surrounding lateral surface that is connected to a peripheral edge of the heat-dissipating surface and a package body formed on the board, wherein the package body covers and is connected to the die and an entirety of the surrounding lateral surface of the thermally conductive adhesive sheet, wherein the die is embedded in the board, the thermally conductive adhesive sheet, and the package body, and wherein the heat-dissipating surface of the thermally conductive adhesive sheet is exposed from the package body, and a thermal conductivity of the thermally conductive adhesive sheet is at least 150% of a thermal conductivity of the package body.Ģ.